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LP3995 Micropower 150mA CMOS Voltage Regulator with Active Shutdown
December 2003
LP3995 Micropower 150mA CMOS Voltage Regulator with Active Shutdown
General Description
The LP3995 regulator is designed to meet the requirements of portable wireless battery-powered applications and will provide an accurate output voltage with low noise and low quiescent current. For battery powered applications the low dropout and low ground current provided by the device allows the lifetime of the battery to be maximized. The Enable(/Disable) control allows the system to further extend the battery lifetime by reducing the power consumption to virtually zero. The Enable(/Disable) function on the device incorporates an active discharge circuit on the output for faster device shutdown. The LP3995 also features internal protection against shortcircuit currents and over-temperature conditions. The LP3995 is designed to be stable with small 1.0 F ceramic capacitors. The small outline of the LP3995 micro SMD package with the required ceramic capacitors can realize a system application within minimal board area. Performance is specified for a -40C to +125C temperature range. The device is available in micro SMD package and LLP package. For other package options contact your local NSC sales office. The device is available in fixed output voltages in the ranges 1.5V to less than 1.8V and 1.8V to less than 2.5Vand 2.5V to 3.3V. For availability, please contact your local NSC sales office.
Key Specifications
n n n n n n n n n 2.5V to 6.0V Input Range Accurate Output Voltage; 75mV / 2% 60 mV Typical Dropout with 150 mA Load Virtually Zero Quiescent Current when Disabled Low Output Voltage Noise Stable with a 1 F Output Capacitor Guaranteed 150 mA Output Current Fast Turn-on; 30 s (Typ.) Fast Turn-off; 175 s (Typ.)
Features
n n n n n n n n 5 pin micro SMD Package 6 pin LLP Package Stable with Ceramic Capacitor Logic Controlled Enable Fast Turn-on Active Disable for Fast Turn-off. Thermal-overload and Short-circuit Protection -40 to +125C Junction Temperature Range for Operation
Applications
n n n n n GSM Portable Phones CDMA Cellular Handsets Wideband CDMA Cellular Handsets Bluetooth Devices Portable Information Appliances
Typical Application Circuit
20034901
(c) 2003 National Semiconductor Corporation
DS200349
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LP3995
Block Diagram
20034902
Pin Description 5 pin micro SMD and LLP - 6
Pin No. micro SMD A1 B2 C1 C3 A3 LLP 3 2 6 1 4 5 Pad VEN GND VOUT VIN CBYPASS N/C GND Enable Input; Disables the Regulator when 0.4V. Enables the regulator when 0.9V Common Ground Voltage output. Connect this output to the load circuit. Voltage Supply Input Bypass Capacitor connection. Connect a 0.01 F capacitor for noise reduction. No internal connection. There should not be any board connection to this pin. Ground connection. Connect to ground plane for best thermal conduction. Symbol Name and Function
Connection Diagrams
micro SMD, 5 Bump Package LLP- 6 Package (SOT23 Footprint)
20034904 20034903
Top View See NS Package Number TLA05
Top View See NS Package Number LDE06A
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LP3995
Ordering Information
For micro SMD Package Output Voltage (V) 1.5 1.6 1.8 1.9 2.1 2.5 2.8 3.0 Grade LP3995 Supplied as 250 Units, Tape and Reel LP3995ITL-1.5 LP3995ITL-1.6 LP3995ITL-1.8 LP3995ITL-1.9 LP3995ITL-2.1 LP3995ITL-2.5 LP3995ITL-2.8 LP3995ITL-3.0 For micro SMD Package unleaded Output Voltage (V) 1.5 (Note 2) 1.6 (Note 2) 1.8 (Note 2) 1.9 (Note 2) 2.1 (Note 2) 2.5 (Note 2) 2.8 (Note 2) 3.0 (Note 2) Grade LP3995 Supplied as 250 Units, Tape and Reel LP3995ITL-1.5 LP3995ITL-1.6 LP3995ITL-1.8 LP3995ITL-1.9 LP3995ITL-2.1 LP3995ITL-2.5 LP3995ITL-2.8 LP3995ITL-3.0 For LLP- 6 Package Output Voltage (V) 1.5 1.6 1.8 1.9 (Note 2) 2.1 (Note 2) 2.5 (Note 2) 2.8 3.0 3.3 (Note 2) Grade LP3995 Supplied as 1000 Units, Tape and Reel LP3995ILD-1.5 LP3995ILD-1.6 LP3995ILD-1.8 LP3995ILD-1.9 LP3995ILD-2.1 LP3995ILD-2.5 LP3995ILD-2.8 LP3995ILD-3.0 LP3995ILD-3.3 LP3995 Supplied as 4500 Units, Tape and Reel LP3995ILDX-1.5 LP3995ILDX-1.6 LP3995ILDX-1.8 LP3995ILDX-1.9 LP3995ILDX-2.1 LP3995ILDX-2.5 LP3995ILDX-2.8 LP3995ILDX-3.0 LP3995ILDX-3.3 Package Marking LO20B LO21B LO22B LO23B LO24B LO25B LO26B LO30B LO31B LP3995 Supplied as 3000 Units, Tape and Reel LP3995ITLX-1.5 LP3995ITLX-1.6 LP3995ITLX-1.8 LP3995ITLX-1.9 LP3995ITLX-2.1 LP3995ITLX-2.5 LP3995ITLX-2.8 LP3995ITLX-3.0 Package Marking LP3995 Supplied as 3000 Units, Tape and Reel LP3995ITLX-1.5 LP3995ITLX-1.6 LP3995ITLX-1.8 LP3995ITLX-1.9 LP3995ITLX-2.1 LP3995ITLX-2.5 LP3995ITLX-2.8 LP3995ITLX-3.0 Package Marking
STD STD STD STD STD STD STD STD
STD STD STD STD STD STD STD STD
STD STD STD STD STD STD STD STD STD
Note 1: Available in sample quantities only Note 2: For availability contact your local sales office
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LP3995
Absolute Maximum Ratings
(Notes 3, 4) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Input Voltage (VIN) Output Voltage Enable Input Voltage Junction Temperature Pad Temperature (Note 5) micro SMD LLP Storage Temperature ESD (Note 7) Human Body Model Machine Model 2 kV 200V 260C 235C -65 to +150C -0.3 to 6.5V -0.3 to (VIN + 0.3V) to 6.5V (max) -0.3 to 6.5V 150C
Operating Ratings (Note 3)
Input Voltage (VIN) Enable Input Voltage Junction Temperature Thermal Resistance JA (micro SMD pkg.) JA (LLP pkg.) Power Dissipation at 25C (Note 6) micro SMD LLP 392 mW 1.136 W 255C/W 88C/W 2.5 to 6.0V 0 to 6.0V -40 to +125C
Electrical Characteristics
Unless otherwise noted, VEN = 1.5, VIN = VOUT + 1.0V, CIN = 1 F, IOUT = 1 mA, COUT = 1 F, cBP = 0.01 F. Typical values and limits appearing in normal type apply for TJ = 25C. Limits appearing in boldface type apply over the full temperature range for operation, -40 to +125C. (Note 12) Symbol VIN VOUT Parameter Input Voltage Output Voltage Tolerance Line Regulation Error micro SMD Load Regulation Error LLP Load Regulation Error PSRR Power Supply Rejection Ratio (Note 9) Output Voltage Tolerance microSMDLine Regulation Error LLP Line Regulation Error micro SMD Load Regulation Error LLP Load Regulation Error PSRR Power Supply Rejection Ratio (Note 9) IOUT = 1 mA VIN = (VOUT(NOM)+1.0V) to 6.0V, IOUT = 1 mA IOUT = 1 mA to 150 mA IOUT = 1 mA to 150 mA f = 1 kHz, IOUT = 1 mA f = 10 kHz, IOUT = 1 mA IOUT = 1 mA VIN = (VOUT(NOM)+1.0V) to 6.0V, IOUT = 1 mA VIN = (VOUT(NOM)+1.0V) to 6.0V, IOUT = 1 mA IOUT = 1 mA to 150 mA IOUT = 1 mA to 150 mA f = 1 kHz, IOUT = 1 mA f = 10 kHz, IOUT = 1 mA 10 80 55 50 10 70 55 53 -50 -75 -2.5 -3.5 50 75 2.5 3.5 75 125 Conditions Typical Limit Min 2.5 -50 -75 -3.5 Max 6.0 50 75 3.5 75 125 Units V
DEVICE OUTPUT: 1.5 VOUT < 1.8V mV mV/V V/mA V/mA
dB
DEVICE OUTPUT: 1.8 VOUT < 2.5V VOUT mV mV/V mV/V V/mA V/mA
dB
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LP3995
Electrical Characteristics
(Continued) Unless otherwise noted, VEN = 1.5, VIN = VOUT + 1.0V, CIN = 1 F, IOUT = 1 mA, COUT = 1 F, cBP = 0.01 F. Typical values and limits appearing in normal type apply for TJ = 25C. Limits appearing in boldface type apply over the full temperature range for operation, -40 to +125C. (Note 12) Symbol Parameter Conditions Typical Limit Min -2 -3 Line Regulation Error micro SMD Load Regulation Error LLP Load Regulation Error Dropout Voltage VIN = (VOUT(NOM)+1.0V) to 6.0V, IOUT = 1 mA IOUT = 1 mA to 150 mA IOUT = 1 mA to 150 mA IOUT = 1 mA IOUT = 150 mA f = 1 kHz, IOUT = 1 mA f = 10 kHz, IOUT = 1 mA (Notes 8, 9) VEN = 1.5V, IOUT = 0 mA VEN = 1.5V, IOUT = 150 mA VEN = 0.4V 85 140 0.003 450 BW = 10 Hz to 100 kHz, VIN = 4.2V Temperature Hysteresis 25 160 20 0.0004 0.002 0.4 60 60 50 0 150 200 1.5 mA Vrms C A -0.1 Max 2 3 0.1 0.002 0.005 2 100 Units
DEVICE OUTPUT: 2.5 VOUT 3.3V VOUT Output Voltage Tolerance IOUT = 1 mA % of VOUT(NOM) %/V %/mA %/mA mV dB
PSRR
Power Supply Rejection Ratio (Note 9) Load Current Quiescent Current
FULL VOUT RANGE ILOAD IQ A
ISC EN TSHUTDOWN
Short Circuit Current Limit Output Noise Voltage ((Note 9)) Thermal Shutdown
ENABLE CONTROL CHARACTERISTICS IEN VIL VIH TON TOFF Maximum Input Current at VEN Input Low Input Threshold High Input Threshold Turn On Time (Note 9) Turn Off Time (Note 9) To 95% Level (Note 10) To 5% Level (Note 11) 30 175 0.9 VEN = 0.0V and VIN = 6.0V 0.001 0.4 A V V s s
TIMING CHARACTERISTICS
Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 4: All voltages are with respect to the potential at the GND pin. Note 5: For information regarding micro SMD and LLP packages please refer to the following application notes; AN-1112 Micro SMD Package Wafer Level Chip Scale Package, AN-1187. Leadless Leadframe Package. Note 6: The maximum power dissipation of the device is dependent on the maximum allowable junction temperature for the device and the ambient temperature. This relationship is given by the formula
PD = (TJ - TA)/JA
Where TJ is the junction temperature, TA is the ambient temperature, and JA is the junction-to-ambient thermal resistance. Assuming an ambient temperature of 25C, for the maximum operating junction temperature of 125C and the micro SMD package JA of 255C/W, this gives a figure of 392 mW for the allowable power dissipation. The derating factor (-1/JA) = -3.9 mW/C, thus below 25C the power dissipation figure can be increased by 3.9 mW/C, and similarly decreased by this factor for temperatures above 25C. Similarly the numbers for the absolute maximum case can be derived using a figure of 150C for the junction temperature. Note 7: The human body model is an 100 pF discharge through a 1.5 k resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Note 8: The device maintains a stable, regulated output voltage without load. Note 9: This electrical specification is guaranteed by design.
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LP3995
Electrical Characteristics
(Continued)
Note 10: Time from VEN = 0.9V to VOUT = 95% (VOUT(NOM)) Note 11: Time from VEN = 0.4V to VOUT = 5% (VOUT(NOM)) Note 12: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at TJ = 25C or correlated using Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Recommended Output Capacitor
Symbol COUT Parameter Output Capacitor Conditions Capacitance (Note 13) ESR VALUE 1.0 Limit Min 0.70 5 500 Max Units F m
Note 13: The capacitor tolerance should be 30% or better over the temperature range. The recommended capacitor type is X7R however, dependant on the application X5R, Y5V, and Z5U can also be used.
Input Test Signals
20034906
FIGURE 1. Line Transient Response Input Test Signal
20034907
FIGURE 2. PSRR Input Test Signal
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LP3995
Typical Performance Characteristics
VIN = VOUT + 1.0V, TA = 25C, Enable pin is tied to VIN. Output Voltage Change vs Temperature
Unless otherwise specified, CIN = COUT = 1.0 F Ceramic, Ground Current vs Load Current (1.8V VOUT)
20034910
20034911
Ground Current vs Load Current (2.8V VOUT)
Ground Current vs VIN @ 25C
20034912
20034913
Ground Current vs VIN @ 125C
Dropout vs Load Current
20034914
20034915
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LP3995
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1.0 F Ceramic, VIN
= VOUT + 1.0V, TA = 25C, Enable pin is tied to VIN. (Continued) Short Circuit Current Line Transient Response (VOUT = 2.8V)
20034916
20034917
Ripple Rejection (VOUT = 1.8V)
Ripple Rejection (VOUT = 2.8V)
20034918
20034919
Enable Start-Up Time (VOUT = 2.8V)
Enable Start-Up Time (VOUT = 2.8V)
20034920
20034921
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LP3995
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1.0 F Ceramic, VIN
= VOUT + 1.0V, TA = 25C, Enable pin is tied to VIN. (Continued) Enable Start-Up Time (VOUT = 1.8V) Enable Start-Up Time (VOUT = 1.8V)
20034922
20034923
Turn-Off Time (VOUT = 2.8V)
Turn-Off Time (VOUT = 1.8V)
20034924
20034925
Load Transient Response (VOUT = 2.8V)
Load Transient Response (VOUT = 1.8V)
20034926
20034927
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LP3995
Application Hints
POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. The Thermal Resistance figure As stated in (Note 6) in the electrical specification section, the allowable power dissipation for the device in a given package can be calculated using the equation:
OUTPUT CAPACITOR The LP3995 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor (dielectric types Z5U, Y5V or X7R) in the 1.0 [to 10 F] range, and with ESR between 5 m to 500 m, is suitable in the LP3995 application circuit. For this device the output capacitor should be connected between the VOUT pin and ground. It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for reasons of size and cost (see the section Capacitor Characteristics). The output capacitor must meet the requirement for the minimum value of capacitance and also have an ESR value that is within the range 5 m to 500 m for stability. NO-LOAD STABILITY The LP3995 will remain stable and in regulation with no external load. This is an important consideration in some circuits, for example CMOS RAM keep-alive applications. CAPACITOR CHARACTERISTICS The LP3995 is designed to work with ceramic capacitors on the output to take advantage of the benefits they offer. For capacitance values in the range of 1 F to 4.7 F, ceramic capacitors are the smallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 1 F ceramic capacitor is in the range of 20 m to 40 m, which easily meets the ESR requirement for stability for the LP3995. The temperature performance of ceramic capacitors varies by type. Most large value ceramic capacitors ( 2.2 F) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by more than 50% as the temperature goes from 25C to 85C. A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable and holds the capacitance within 15% over the temperature range. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 1 F to 4.7 F range. Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1 as the temperature goes from 25C down to -40C, so some guard band must be allowed. NOISE BYPASS CAPACITOR A bypass capacitor should be connected between the CBP pin and ground to significantly reduce the noise at the regulator output. This device pin connects directly to a high impedance node within the bandgap reference circuitry. Any significant loading on this node will cause a change on the regulated output voltage. For this reason, DC leakage current through this pin must be kept as low as possible for best output voltage accuracy. The use of a 0.01uF bypass capacitor is strongly recommended to prevent overshoot on the output during start-up.
With a JA = 255C/W, the device in the micro SMD package returns a value of 392 mW with a maximum junction temperature of 125C. With a JA = 88C/W, the device in the LLP package returns a value of 1.136 mW with a maximum junction temperature of 125C. The actual power dissipation across the device can be represented by the following equation: PD = (VIN - VOUT) x IOUT. This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. These two equations should be used to determine the optimum operating conditions for the device in the application. EXTERNAL CAPACITORS In common with most regulators, the LP3995 requires external capacitors to ensure stable operation. The LP3995 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitors must be correctly selected for good performance. INPUT CAPACITOR An input capacitor is required for stability. It is recommended that a 1.0 F capacitor be connected between the LP3995 input pin and ground (this capacitance value may be increased without limit). This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input. Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a lowimpedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be guaranteed by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain 1.0 F over the entire operating temperature range.
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LP3995
Application Hints
(Continued)
within the reference block allowing a very fast ramp of the output voltage to reach the target voltage. micro SMD MOUNTING The micro SMD package requires specific mounting techniques which are detailed in National Semiconductor Application Note AN-1112. Referring to the section Surface Mount Technology (SMT) Assembly Considerations, it should be noted that the pad style which must be used with the 5 pin package is NSMD (non-solder mask defined) type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. micro SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct sunlight will cause incorrect operation of the device. Light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with wavelengths in the red and infra-red part of the spectrum have the most detrimental effect thus the fluorescent lighting used inside most buildings has very little effect on performance. Tests carried out on a micro SMD test board showed a negligible effect on the regulated output voltage when brought within 1 cm of a fluorescent lamp. A deviation of less than 0.1% from nominal output voltage was observed.
The types of capacitors best suited for the noise bypass capacitor are ceramic and film. High quality ceramic capacitors with NPO or COG dielectric typically have very low leakage. Polypropolene and polycarbonate film capacitors are available in small surface-mount packages and typically have extremely low leakage current. Unlike many other LDO's, the addition of a noise reduction capacitor does not effect the transient response of the device. ENABLE OPERATION The LP3995 may be switched ON or OFF by a logic input at the ENABLE pin, VEN. A high voltage at this pin will turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3 nA. If the application does not require the shutdown feature, the VEN pin should be tied to VIN to keep the regulator output permanently on. To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. FAST TURN OFF AND ON The controlled switch-off feature of the device provides a fast turn off by discharging the output capacitor via an internal FET device. This discharge is current limited by the RDSon of this switch. Fast turn-on is guaranteed by control circuitry
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LP3995
Physical Dimensions
inches (millimeters) unless otherwise noted
micro SMD, 5 Bump, Package (TLA05) NS Package Number TLA05ADA The dimensions for X1, X2 and X3 are given as: X1 = 1.006 +/- 0.03mm X2 = 1.438 +/- 0.03mm X3 = 0.600 +/- 0.075mm
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LP3995 Micropower 150mA CMOS Voltage Regulator with Active Shutdown
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
LLP, 6 Lead, Package (SOT23 Land) NS Package Number LDE06A
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ``Banned Substances'' as defined in CSP-9-111S2.
National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Francais Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

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